열 인터페이스 재료의 녹색 탄화규소 마이크로 분말
Green silicon carbide micro powder delivers bulk thermal conductivity of 120–150 W/m·K, making it a cost-effective filler for high-performance thermal interface materials in power electronics. This guide covers particle size selection, surface treatment protocols, loading strategies, and full procurement specifications for TIM-grade GSiC.
