サーマルインターフェース材料におけるグリーン炭化ケイ素マイクロパウダー
Green silicon carbide micro powder delivers bulk thermal conductivity of 120–150 W/m·K, making it a cost-effective filler for high-performance thermal interface materials in power electronics. This guide covers particle size selection, surface treatment protocols, loading strategies, and full procurement specifications for TIM-grade GSiC.
